- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Patent holdings for IPC class H01L 21/324
Total number of patents in this class: 3898
10-year publication summary
|
460
|
629
|
593
|
522
|
449
|
464
|
212
|
162
|
162
|
53
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
498 |
| Applied Materials, Inc. | 16587 |
418 |
| International Business Machines Corporation | 60644 |
233 |
| Fuji Electric Co., Ltd. | 4750 |
102 |
| Tokyo Electron Limited | 11599 |
96 |
| Infineon Technologies AG | 8189 |
82 |
| Screen Holdings Co., Ltd. | 2431 |
76 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
68 |
| United Microelectronics Corp. | 3921 |
63 |
| Texas Instruments Incorporated | 19376 |
60 |
| Kokusai Electric Corporation | 1791 |
57 |
| Lam Research Corporation | 4775 |
56 |
| Samsung Electronics Co., Ltd. | 131630 |
54 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
49 |
| Shin-Etsu Handotai Co., Ltd. | 1277 |
49 |
| Semiconductor Energy Laboratory Co., Ltd. | 10902 |
45 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
44 |
| Renesas Electronics Corporation | 6305 |
37 |
| Intel Corporation | 45621 |
36 |
| Soitec | 892 |
35 |
| Other owners | 1740 |